品2 包封膜結(jié)構(gòu)圖.jpg)
Product Usage
Matched with polyimide copper-clad laminates, used for covering and protecting flexible printed circuit boards
PI film thickness
12.5, 25, 50um, etc.
Outer layer thickness
15. 25, 50um, etc.
Product Features
Excellent peel strength
Superior comprehensive performance
Appropriate surface adhesion
Can be stored at room temperature
Stable liquidity
Compliant with RoHS and REACH directives, halogen-free and environmentally friendly
UL certified products
品2 包封膜性能表.jpg)
Product Usage
Matched with polyimide copper-clad laminates, used for covering and protecting flexible printed circuit boards
PI film thickness
12.5, 25, 50um, etc.
Outer layer thickness
15. 25, 50um, etc.
Product Features
Excellent peel strength
Superior comprehensive performance
Appropriate surface adhesion
Can be stored at room temperature
Stable liquidity
Compliant with RoHS and REACH directives, halogen-free and environmentally friendly
UL certified products
Scan
Official account
