Product Usage
Matched with polyimide copper-clad laminates, used to enhance and protect flexible printed circuits
PI film thickness
75、100、125、150、175、200、225、250、275… … 900um, etc.
Outer adhesive layer thickness
15. 25, 50um, etc.
Product Features
Superior dimensional stability
No warping after high-temperature processing
Some models have extremely high rigidity
Excellent peel strength
Compliant with RoHS and REACH directives, halogen-free and environmentally friendly
UL certified products
