品4 單雙面覆銅板結(jié)構(gòu)圖.jpg)
Product Usage
Used in conjunction with encapsulation film, thermosetting adhesive film and other materials for circuit fabrication in printed circuit boards Product Features
Customizable copper foil/base film thickness
Excellent peel strength and dimensional stability
High localization rate, excellent cost-effectiveness
Compliant with RoHS and REACH directives, halogen-free and environmentally friendly
UL certified product, flame retardant up to 94V-0 level
品4 單雙面覆銅板性能表.png)
Product Usage
Used in conjunction with encapsulation film, thermosetting adhesive film and other materials for circuit fabrication in printed circuit boards Product Features
Customizable copper foil/base film thickness
Excellent peel strength and dimensional stability
High localization rate, excellent cost-effectiveness
Compliant with RoHS and REACH directives, halogen-free and environmentally friendly
UL certified product, flame retardant up to 94V-0 level
Scan
Official account
